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  • Nhan đề: A numerical study of failure of an adhesive joint influenced by a void in the adhesive /Ahmed Sengab a , Ramesh Talreja a,b,c,

Tác giả CN Sengab,Ahmed
Nhan đề A numerical study of failure of an adhesive joint influenced by a void in the adhesive /Ahmed Sengab a , Ramesh Talreja a,b,c,
Từ khóa tự do Adhesive joints
Từ khóa tự do Crack kinking
Từ khóa tự do Interface cracking
Nguồn trích Composite structures2016-11 Số: 1 Tập: 156
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100 |aSengab,Ahmed
245 |aA numerical study of failure of an adhesive joint influenced by a void in the adhesive /Ahmed Sengab a , Ramesh Talreja a,b,c,
653 |aAdhesive joints
653 |aCrack kinking
653 |aInterface cracking
773 |tComposite structures|v156|i1|d2016-11
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