- Bài trích
- Nhan đề: A numerical study of failure of an adhesive joint influenced by a void in the adhesive /Ahmed Sengab a , Ramesh Talreja a,b,c,
Tác giả CN
| Sengab,Ahmed |
Nhan đề
| A numerical study of failure of an adhesive joint influenced by a void in the adhesive /Ahmed Sengab a , Ramesh Talreja a,b,c, |
Từ khóa tự do
| Adhesive joints |
Từ khóa tự do
| Crack kinking |
Từ khóa tự do
| Interface cracking |
Nguồn trích
| Composite structures2016-11
Số: 1
Tập: 156 |
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001 | 16462 |
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002 | 6 |
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004 | 75EECF22-4450-4038-B9B0-094625D1A0B8 |
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005 | 201708281354 |
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008 | 081223s vm| vie |
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009 | 1 0 |
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039 | |y20170828140145|zcuonglv |
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100 | |aSengab,Ahmed |
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245 | |aA numerical study of failure of an adhesive joint influenced by a void in the adhesive /Ahmed Sengab a , Ramesh Talreja a,b,c, |
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653 | |aAdhesive joints |
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653 | |aCrack kinking |
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653 | |aInterface cracking |
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773 | |tComposite structures|v156|i1|d2016-11 |
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890 | |c1|a0|b0|d2 |
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